Flexible pillars for displacement compensation in optical chip assembly |
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Authors: | A.L. Glebov D. Bhusari P. Kohl M.S. Bakir J.D. Meindl M.G. Lee |
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Affiliation: | Adv. Optoelectronics Technol. Dept., Fujitsu Labs. of America, Sunnyvale, CA, USA; |
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Abstract: | In chip-to-chip optical interconnect systems with surface mounted light-sources and detectors, thermal and mechanical effects can cause lateral displacements of the assembled devices. These displacements can result in optical signal losses that can critically deteriorate the bit-error-rate of the digital system. We demonstrate that, for a given loss budget of 1 dB, the use of flexible optical pillars with 150-/spl mu/m height and 50-/spl mu/m diameter can double the lateral displacement tolerance from about 15 to 30 /spl mu/m. The pillars fabricated from Avatrel polymer form an air-free path between the light source and the substrate and cause maximum optical power losses less than 0.2 dB. |
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