| MEMS划片技术的现状与技术革新 |
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| 引用本文： | 范亚飞.MEMS划片技术的现状与技术革新[J].半导体技术,2008,33(4):296-299. |
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| 作者姓名： | 范亚飞 |
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| 作者单位： | 东精精密设备(上海)有限公司,上海,200120 |
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| 摘 要： | MEMS独特的结构和特性,给划片工艺带来了巨大的挑战.介绍了传统砂轮划片技术在MEMS芯片生产中的局限性,指出了隐形激光划片技术的优越性,综述了激光划片技术在MEMS划片中的应用,对几种较成熟的先进激光划片技术进行了比较,对各自的工作原理、特点、工序作了重点阐述,并对MEMS划片技术的发展前景作了展望.
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| 关 键 词： | 微机电系统 传统划片 微水刀激光划片 隐形激光划片 |
| 文章编号： | 1003-353X(2008)04-0296-04 |
| 修稿时间： | 2007年12月19 |
Status and Technological Innovation of MEMS Dicing Process |
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| Fan Yafei.Status and Technological Innovation of MEMS Dicing Process[J].Semiconductor Technology,2008,33(4):296-299. |
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| Authors: | Fan Yafei |
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| Affiliation: | Fan Yafei(Accretech(China)Co.,Ltd.,Shanghai 200120,China) |
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| Abstract: | The unique structures and characteristics of MEMS(micro electro mechanical systems)devices bring tremendous challenges for MEMS dicing process.The limitation of traditional microelectronic dicing methods for MEMS devices is discussed.The development and application of laser dicing for MEMS dicing process are summarized.It is pointed that stealth laser dicing makes better performance,simplifies dicing process and has low cost.Laser dicing techniques for MEMS chips is summarized.The operating principle,charac... |
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| Keywords: | MEMS traditional dicing water jet guided laser dicing stealth laser dicing |
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