微喷射技术制备的化学镀金属银线微结构

采用一种称为微喷射的新方法制备了微米尺度金属银线。在该方法中,用压电陶瓷驱动器提供的微振动实现微喷嘴内部液柱的均匀破碎和喷射,并通过微喷射系统,把银氨溶液和还原剂溶液喷射到基材表面。采用金属化学沉积技术,在室温下还原出金属银,并沉积在指定的位置。构建的微喷射系统具有脉冲可控和喷射量可控的特征,并且能够实现皮升(picoliter)到飞升(femto-liter)级的微量液体的喷射,因此能够在玻璃基材上获得致密的金属银线,线宽可以按照需要在数微米至数百微米范围内调整。该方法可以在平面或曲面上直写微电路制作微型PCB线路板。由于镀层的可叠加性,该技术还可以用于三维金属微构件的制造。

Microstructure of Silver Lines Formed by Electroless Deposition Using Micro-injection Method

A method of micro-injection was employed to prepare micron scale silver lines at room temperature.The micro-fluid column in the micro-nozzle was uniformly dispersed and injected by a piezoelectric ceramic actuator with a low frequency vibration and the reductive agent and silver ammonia solution were injected on a surface of substrate by the micro-injection system,resulting in electroless deposition of silver on the specific places of the substrate surface.Because the Micro-injection system can be digitally controlled and the content of solution can be injected from femo-fiter to pico-filter by control,a compact silver line can be obtained and its width is changed in a range of several to hundreds micrometer depending on requirements.The technology can be used to directly fabricate microscale PCB board on plane or curve surface during preparation of micro-circuits and manufacture micro-components of metal in three dimensions due to superposition of the composite coats.