提升芯片智能化生产的器件失效分析

智能化自动化生产是现代化芯片生产的主要发展趋势之一，通过失效分析手段进行芯片良率提升并将失效数据模型补充至智能化生产的监测管理是自动化芯片代工的重要手段。本文以60 V沟槽功率器件为研究对象，通过完成芯片制造全流程后电性测试得到的良率数据，从失效检测的电性、剖面形貌出发，利用结构形貌结果反推工艺失效节点，并建立失效数据库。结果表明，采用热点分析及高倍电镜观察可快速排查芯片的器件失效的结构，并根据工艺流程迅速判断失效工艺步骤。

Device Failure Analysis for Improving Chip Intelligent Manufacture

Intelligent automated manufacture is one of the main development trends of modern chip production. It is an important means of automatic chip foundry to improve the qualified chip yield through failure analysis and to supplement the failure data model to the monitoring and management of intelligent production. This study takes the 60 V trench power device as the research object, obtains the yield datafrom the electrical test after completing the whole process of chip manufacturing, and reverses the process failure node starting from the electrical properties and cross-sectional appearance of the failure detection through using the structural appearance results. As a result, a failure database is established. The results show that using hot spot analysis and high-magnification electron microscope observation can quickly check the structure of the device failure of the chip, and can quickly judge the failure process step according to the process flow.