聚酰亚胺纸基材料的热老化研究

利用热失重分析了不同厚度聚酰亚胺(PI)纸基材料的热稳定性,采用Coats-Redfern法计算PI纸基材料的分解动力学参数,并预测其长期使用上限温度。实验结果表明:在氮气气氛中,PI纸基材料具有很好的热稳定性,且厚度越大,热稳定性越好。通过Coats-Redfern方法得知,PI纸基材料的热分解反应为二级反应;厚度较大的PI纸基材料具有较高的活化能E和使用上限温度,且不同厚度的PI纸基材料的耐热等级均为H级以上。最后,利用扫描电子显微镜和傅里叶变换红外光谱仪对PI纸基材料的热分解机理进行了分析。

The Thermal Aging Research of Polyimide Paper-based Materials

The thermal stability of polyimide (PI) paper-based materials with different thickness was analyzed by thermo-gravimetric. The Coats-Redfern method was applied to calculate the decomposition kinetic parameters and predict the ceiling temperature in long-term use of PI paper-based materials. The results showed that PI paper-based materials had good thermal stability in nitrogen atmosphere, and the thicker PI paper had better thermal stability. By the method of Coats-Redfern, reaction order of thermal decomposition of PI paper-based materials closed to 2. Thicker PI paper-based materials possessed higher activation energy E and higher ceiling temperature, and the temperature classification of PI paper-based materials with different thickness was above H. Finally, SEM and FTIR were used to analyze the thermal decomposition mechanism of PI paper-based materials.