| LTCC基板与封装的一体化制造 |
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| 引用本文： | 何中伟,王守政. LTCC基板与封装的一体化制造[J]. 电子与封装, 2004, 4(4): 20-23 |
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| 作者姓名： | 何中伟 王守政 |
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| 作者单位： | 华东光电集成器件研究所,安徽,蚌埠,233042;华东光电集成器件研究所,安徽,蚌埠,233042 |
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| 摘 要： | 本文介绍了LTCC一体化基板/外壳封装的设计、制作与性能检测。
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| 关 键 词： | 一体化基板/外壳 LTCC 钎焊 PGA |
| 修稿时间： | 2004-01-11 |
The Integrative Manufacturing of the LTCC Substrate and Its Package |
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| He Zhongwei,Wang Shouzheng East China Institute of Photo-Electron IC,Bengbu Anhui. The Integrative Manufacturing of the LTCC Substrate and Its Package[J]. Electronics & Packaging, 2004, 4(4): 20-23 |
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| Authors: | He Zhongwei Wang Shouzheng East China Institute of Photo-Electron IC Bengbu Anhui |
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| Affiliation: | He Zhongwei,Wang Shouzheng East China Institute of Photo-Electron IC,Bengbu Anhui 233042 |
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| Abstract: | The design, fabrication and performance testing of a kind of LTCC Integral Substrate/Package(ISP) are described in the paper. |
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| Keywords: | ISP LTCC Brazing PGA |
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