首页 | 本学科首页   官方微博 | 高级检索  
     

热固性复合材料固化过程中温度场的三维有限元分析
引用本文:张纪奎,关志东,郦正能. 热固性复合材料固化过程中温度场的三维有限元分析[J]. 复合材料学报, 2006, 23(2): 175-179
作者姓名:张纪奎  关志东  郦正能
作者单位:北京航空航天大学,航空科学与工程学院飞机系,北京,100083;北京航空航天大学,航空科学与工程学院飞机系,北京,100083;北京航空航天大学,航空科学与工程学院飞机系,北京,100083
基金项目:“凡舟”基金资助项目(20050504)
摘    要:根据热传导和固化动力学理论, 采用三维有限元方法, 对正交各向异性复合材料层合板固化过程的温度和固化度历程及其变化规律进行数值模拟研究。在有限元分析中节点自由度为温度和固化度, 考虑了两者之间的耦合作用。计算结果表明: 厚度越大, 温度峰值越高, 中心点开始固化越晚; 不同纤维体积含量层合板在固化初期是同步的; 中心点温度超过保温平台(85 ℃) 后, 随着环境温度继续升高, 纤维体积含量越低, 中心点温度峰值越大, 出现时间越早。 

关 键 词:热固性复合材料  固化温度  固化度  有限元分析
文章编号:1000-3851(2006)02-0175-05
收稿时间:2005-08-09
修稿时间:2005-08-092005-11-16

Three-dimensional f inite element analysis for the temperaturef ield of thermoset composites during cure process
ZHANG Jikui,GUAN Zhidong,LI Zhengneng. Three-dimensional f inite element analysis for the temperaturef ield of thermoset composites during cure process[J]. Acta Materiae Compositae Sinica, 2006, 23(2): 175-179
Authors:ZHANG Jikui  GUAN Zhidong  LI Zhengneng
Affiliation:Department of Airplane| School of Aeronautics Science and Engineering|Beijing University of Aeronautics and Ast ronautics| Beijing 100083| China
Abstract:Based on the thermal conduct theory and cure kinetics , the history of cure temperature and degree ofcure was investigated for the orthot ropic laminate during curing. The temperature and degree of cure were chosen astwo additional degrees of nodes in FEM models , and the coupling of them was taken into account . The result showsthat : for the thick laminate , the peak value of the temperature was increased , and the initiation of the crosslinkingreaction at the center point was late ; for the laminates with different fiber content s , the development of the degree ofcure is synchronic at the early stage of the curing process , when the temperature is higher than that of the dwell(85 ℃) , the lower the fiber content in the laminates , the higher the peak value of temperature at the center of thelaminates , and it s corresponding time is quicker.
Keywords:thermoset composites   cure temperature   cure degree   FEA
本文献已被 CNKI 维普 万方数据 等数据库收录!
点击此处可从《复合材料学报》浏览原始摘要信息
点击此处可从《复合材料学报》下载免费的PDF全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号