| Pr,Nd对Sn0.3Ag0.7Cu0.5Ga无铅钎料显微组织的影响 |
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| 引用本文： | 韩翼龙,薛松柏,薛鹏,王禾,龙伟民,张冠星,张青科. Pr,Nd对Sn0.3Ag0.7Cu0.5Ga无铅钎料显微组织的影响[J]. 焊接学报, 2017, 38(1): 103-106 |
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| 作者姓名： | 韩翼龙 薛松柏 薛鹏 王禾 龙伟民 张冠星 张青科 |
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| 作者单位： | 1.南京航空航天大学 材料科学与技术学院, 南京 210016 |
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| 基金项目： | 南京航空航天大学研究生创新基地（试验室）开放基金资助项目（kfjj20150604）；中央高校基本科研业务费专项资金资助项目；江苏高校优势学科建设工程资助项目 |
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| 摘 要： | 分析了添加两种稀土元素Pr，Nd对Sn-0.3Ag-0.7Cu-0.5Ga无铅钎料基体组织、焊点界面组织的影响并测定了焊点抗剪强度.结果表明，在该钎料中分别添加Pr，Nd元素可以改善钎料的显微组织，且加入Pr元素的效果优于Nd.添加Pr元素的钎料基体组织中金属间化合物分布均匀，而后者易在晶界处产生“区域”状金属间化合物，成为裂纹的发源地.稀土元素的吸附作用可以降低钎料与铜基板界面反应的剧烈程度，从而改善界面的形貌.添加Pr元素的钎料可以更好地与铜基板结合，从而提高了焊点的抗剪强度.
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| 关 键 词： | Pr Nd 无铅钎料 显微组织 |
| 收稿时间： | 2015-08-20 |
Effects of rare earth element Pr and Nd on microstructure of Sn-0.3Ag-0.7Cu-0.5Ga lead-free solder |
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| HAN Yilong,XUE Songbai,XUE Peng,WANG He,LONG WeiMin,ZHANG Guanxing and ZHANG Qingke. Effects of rare earth element Pr and Nd on microstructure of Sn-0.3Ag-0.7Cu-0.5Ga lead-free solder[J]. Transactions of The China Welding Institution, 2017, 38(1): 103-106 |
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| Authors: | HAN Yilong XUE Songbai XUE Peng WANG He LONG WeiMin ZHANG Guanxing ZHANG Qingke |
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| Affiliation: | 1.College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China2.State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China |
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| Abstract: | The effects of rare earth element Pr and Nd addition on the microstructure of matrix and interface of Sn-0.3Ag-0.7Cu-0.5Ga lead free solder were investigated, so was the shearing strength of the solder joints. The results show that the microstructure of the solder matrix was optimized with the addition of Pr and Nd, and the effect of Pr on the solder is better than that of Nd. The intermetallic compounds (IMC) of the solder matrix with the addition of rare earth element Pr distribute homogeneously, but it appears regional IMCs with the addition of rare earth element Nd which become the birthplace of the cracks. The absorption of rare earth elements can reduce the interface reaction between solder and Cu substrate, improve the morphology of the interface. The solder with Pr addition can combine with Cu substrate preferably so the shearing strength of the solder joints can be enhanced better. |
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| Keywords: | praseodymium neodymium lead-free solder microstructure |
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