电子封装用高导热金属基复合材料的研究

高导热金属基复合材料具有优异的热物理性能,且密度较低,是非常理想的电子封装材料。但是由于其本身高的脆性和硬度,使得该材料很难通过二次机械加工成所需要的形状,严重制约了该材料的应用。本文总结了本实验室在第三代SiCp/Al电子封装材料以及第四代金刚石/Cu（或Al）电子封装材料的近净成形制备方面所取得的一些突破性成果,并就相关的关键工艺进行了讨论,论文最后对电子封装用高导热金属基复合材料未来的发展做出了展望。

Preparation of High Thermal Conductivity Metal Matrix Composites for Electronic Packaging

High thermal conductivity metal matrix composite materials are ideal for electronic packaging materials, because of their excellent thermal physical properties and low density. However, due to their high brittleness and hardness, these materials have not been widely used because they are hard to be machined into complex-shape. This article summarizes some breakthroughs in our laboratory in near-net shape forming of third-generation SiCp/AI electronic packaging materials and fourth-generation diamond/ Cu （or AI） electronic packaging materials, as well as some discussion of some key process parameter. And in the end, the future development prospects of high thermal conductivity metal matrix composites have made.