Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder |
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| Affiliation: | 1. Department of Mechanical Engineering, Worcester Polytechnic Institute, Worcester, MA 01609, USA;2. Substrate Solution, Samsung Electro-Mechanics, Busan 46754, Republic of Korea;3. ACI Division, Samsung Electro-Mechanics, Busan 46754, Republic of Korea;4. School of Materials Science and Engineering, Pusan National University, Busan 46241, Republic of Korea;5. Department of Materials Science and Engineering, Hongik University, Seoul 04066, Republic of Korea;1. Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, 4072 St Lucia, Queensland, Australia;2. Centre of Excellence Geopolymer and Green Technology, School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah 02600, Jejawi, Arau, Perlis, Malaysia;3. Department of Materials, Imperial College, London SW7 2AZ, United Kingdom;4. Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan |
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| Abstract: | The electroless nickel immersion gold (ENIG) process results in surface defects, such as pinholes and black pads, which weaken the solder joint and eventually degrade the reliability of the PCB. Contamination of the plating solutions, including dissolution of the solder resist (SR), can be a cause of the pinholes and black pads. This study examined the effects of SR dissolution on the solder joint reliability and electroless Ni plating properties. Electroless Ni plating was performed by adding 1 to 10 ppm hardener (melamine) to the fresh Ni solution. Many black pads were observed in the 7 and 10 ppm hardener-added surfaces. In addition, the content of P was highest when 7 and 10 ppm hardener was added. The ball shear tests were carried out to confirm the joint reliability between the ENIG surface with hardener-added and the Sn-3.0Ag-0.5Cu solder (SAC 305). The ball shear strength decreased with increasing dissolution of the hardener. In particular, the shear strength was the lowest at 7 and 10 ppm hardener addition. In addition, the failure mode of the solder joint was changed from ductile to brittle mode with increasing hardener addition. That is, as the hardener additive increases, intermetallic compound (IMC) phases were changed from (Cu,Ni)6Sn5 to (Cu,Ni)3Sn4 and Cu6Sn5 (brittle structure). |
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