Special issue: International conference on thermal,mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017] |
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| Affiliation: | 1. Signify & Delft University of Technology, The Netherlands;2. Wrocław University of Technology, Faculty of Microsystem Electronics and Photonics, Poland;1. Institute of Microelectronics of Chinese Academy of Sciences, 3rd Beitucheng West Road, Chaoyang Qu, 10029 Beijing, China;2. University of Chinese Academy of Sciences, 19th Yuquan Road, Shijingshan Qu, 100049 Beijing, China;1. Electrotechnics and Measurements Department, Technical University of Cluj-Napoca, Baritiu 26-28, Cluj-Napoca, Romania;2. Infineon Technologies Romania & Co. SCS, Dimitrie Pompeiu 6, Sector 2, București, Romania;3. Basis of Electronics Department, Technical University of Cluj-Napoca, Baritiu 26–28, Cluj-Napoca, Romania |
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