Importance of test parameters,specimen type and use configuration on the identification of Sn/Ag solder behaviour laws |
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Affiliation: | 1. ENIT - LGP – INPT, Université de Toulouse 47, Avenue d''Azereix, 65016 Tarbes Cedex, France;2. PHIMECA Engineering Centre d''Affaires du Zénith, 34 rue de Sarliève, 63800 Cournon d''Auvergne, France;1. KBRWyle, 2601 Mission Point Blvd, Suite 300, Dayton, OH 45431, United States;2. Air Force Research Laboratory, Sensors Directorate, 2241 Avionics Circle, WPAFB, OH 45433, United States;3. Department of Chemistry, Wright State University, 3640 Col. Glenn Hwy., Dayton, OH 45435, United States;1. Materials Center Leoben Forschung GmbH (MCL), Roseggerstraße 12, A-8700 Leoben, Austria;2. Tridonic Jennersdorf GmbH, Technologiepark 10, A-8380 Jennersdorf, Austria;3. Häusermann GmbH, Zitternberg 100, A-3571 Gars am Kamp, Austria;4. Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany;1. Infineon Technologies Austria AG, Siemensstraße 2, 9500 Villach, Austria;2. TU Wien,Institute of Solid State Electronics, Floragasse 4, 1040 Vienna, Austria |
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