| 超细间距方形扁平封装与球栅阵列封装的比较及其发展趋势 |
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| 引用本文： | 杨建生.超细间距方形扁平封装与球栅阵列封装的比较及其发展趋势[J].微电子技术,2003,31(2):61-65. |
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| 作者姓名： | 杨建生 |
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| 作者单位： | 天水永红器材厂技术处,甘肃,天水市,741000 |
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| 摘 要： | 本文主要论述了超细间距QFP封装与BGA封装的比较，以及BGA封装的检查、返修、清洗及其各种类型，并简述了它们的利用率和发展趋势。
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| 关 键 词： | 方形扁平封装 球栅阵列封装 比较 利用率 发展趋势 |
| 文章编号： | 1008-0147(2003)02-61-05 |
| 修稿时间： | 2002年8月28日 |
Comparison between Ultra- fine Pitch QFPs and BGAs and their Future |
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| YANG Jian-sheng.Comparison between Ultra- fine Pitch QFPs and BGAs and their Future[J].Microelectronic Technology,2003,31(2):61-65. |
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| Authors: | YANG Jian-sheng |
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| Abstract: | The comparison between ultra-fine pitch QFPs and BGAs is presented in this article. The inspection, cleaning, repairing and their availabilities of QFPs and BGAs are also described The development of QFPs and BGAs in the future is discussed in the end |
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| Keywords: | QFP BGA Comparison Availability Future development |
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