大功率半导体激光器实用化微通道热沉

大功率半导体激光器实用化微通道热沉根据大功率半导体器无氧铜微通道热沉的实用化制备工艺特点,利用商用CFD软件FLUENT对微通道热沉内部微通道散热区层间折转通道宽度和热沉前端面壁厚度进行优化设计,并采用化学腐蚀结合扩散焊技术制备无氧铜微通道热沉,微通道尺寸为27 mm×11 mm×1.5 mm.利用低电光转换效率大功率半导体激光阵列器件对所制备热沉进行散热能力测试,激光阵列宽1 cm,腔长1 000μm,条宽200μm,填充因子为50%,微通道热沉热阻0.34 K/W,能满足半导体激光阵列器件高功率集成输出的散热需求.

Microchannel Heatsink of High Power Semiconductor Laser

Structural parameters of microchannel heatsink such as thickness of the front wall and width of the turn-over channel are optimized through numerical calculation based on general industrial processing.And copper microehannel heatsinks are fabricated by using photophobia,chemical etch and diffusion welding technology.Semiconductor laser bars,with cavity length of 1 mm,emitter width of 200μm and 50%of fillfactors are packaged on the presented microchannel heatsinks and tested.With an exterior size of 27 mm × 11mm×1.5 mm,thermal resistance of microchannel heatsink reaches 0.34 K/W,which meets the need of cooling of high power semiconductor laser bars.