| 某大功率功放的热设计 |
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| 引用本文： | 李伟春,梁亚冲. 某大功率功放的热设计[J]. 电子机械工程, 2003, 19(1): 31-32,35 |
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| 作者姓名： | 李伟春 梁亚冲 |
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| 作者单位： | 广州海格通信有限公司,广东,广州,510656 |
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| 摘 要： | 介绍了某新型大功率功放的热设计方案。由于采用热管与冷板相结合的冷却方案，大大提高了该功放的散热效果。该方案的可行性已得到了初步的试验验证。
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| 关 键 词： | 大功率功放 热设计 功率放大器 散热 测试 |
| 文章编号： | 1008-5300(2003)01-0031-02 |
Thermal Design of a High-power Amplifier |
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| Li Wei-chun and Liang Ya-chong. Thermal Design of a High-power Amplifier[J]. Electro-Mechanical Engineering, 2003, 19(1): 31-32,35 |
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| Authors: | Li Wei-chun and Liang Ya-chong |
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| Affiliation: | Guangzhou Haige Telecommunication Co. , Ltd and Guangzhou Haige Telecommunication Co. , Ltd |
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| Abstract: | This paper introduces a new method of thermal design for high-power amplifiers, in which the combination of heat pipe and cold ?plate was successfully used. This approach has greatly improved the reliability of electronics. The feasibility of this approach has been validated by test. |
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| Keywords: | Thermal design Heat pipe Cold-plate |
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