| HgCdTe芯片粘接可靠性设计 |
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| 引用本文： | 李建林. HgCdTe芯片粘接可靠性设计[J]. 红外技术, 2000, 22(1): 29. DOI: 10.3969/j.issn.1001-8891.2000.01.007 |
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| 作者姓名： | 李建林 |
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| 作者单位： | 昆明物理研究所!云南昆明650223 |
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| 摘 要： | 根据ＨｇＣｄＴｅ材料的特性和７７Ｋ低温下工作的要求，结合目前研磨抛光的技术水平，从粘接机理和传热学等方面分析计算了粘接界面的最小接触高度、接触热阻和热应力，给出理想粘接界面的模型，介绍了胶层厚度对器件性能的影响，提出选择ＨｇＣｄＴｅ芯片粘接剂的主要依据和减小粘接界面接触热阻的技术途径。
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| 关 键 词： | 芯片粘接 |
A Reliable Design of HgCdTe Chips Attachment |
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| LI Jian lin. A Reliable Design of HgCdTe Chips Attachment[J]. Infrared Technology, 2000, 22(1): 29-32. DOI: 10.3969/j.issn.1001-8891.2000.01.007 |
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| Authors: | LI Jian lin |
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| Abstract: | Based on the analysis on HgCdTe material characteristics, operating temperature of HgCdTe detector and state of the art polish, th minimum contact distance, heat resistance and stress were calculated. The ideal contact model was presented. The detector performance influenced by adhesive thickness was indicated.Technical ways for the decreasing contact heat resistance and main factors of selecting HgCdTe chips adhesive were provided. |
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| Keywords: | HgCdTe adhesive contact heat resistance heat stress |
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