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单颗金刚石磨粒磨削SiCp/Al复合材料的仿真研究
引用本文:张春燕,孙圆,赵礼刚.单颗金刚石磨粒磨削SiCp/Al复合材料的仿真研究[J].工具技术,2013(11):15-18.
作者姓名:张春燕  孙圆  赵礼刚
作者单位:江苏科技大学
摘    要:利用有限元分析软件Abaqus对单颗金刚石磨粒磨削SiCp/Al复合材料的加工过程进行了模拟仿真,分析了磨削速度和磨削深度对磨削力的影响,研究了工件被磨削后的表面形貌、残余应力分布情况,为优化金刚石砂轮磨削SiCp/Al复合材料的工艺参数提供参考.

关 键 词:Abaqus  金刚石磨粒  SiCp  Al复合材料  仿真  磨削力  表面形貌  残余应力

Simulation of Single Diamond Abrasive Particle Grinding SiCp/Al Composites
Zhang Chunyan,Sun Yuan,Zhao Ligang.Simulation of Single Diamond Abrasive Particle Grinding SiCp/Al Composites[J].Tool Engineering(The Magazine for Cutting & Measuring Engineering),2013(11):15-18.
Authors:Zhang Chunyan  Sun Yuan  Zhao Ligang
Affiliation:Zhang Chunyan, Sun Yuan, Zhao Ligang
Abstract:The finite element analysis was carried out, in which the software Abaqus was used to simulate the process of a single diamond abrasive particle grinding SiCp/Al composites. The influence of grinding speed and grinding depth on grinding force was analyzed. The surface topography, residual grinding stress of processed SiCp/A1 composites was stud- ied. The results provides the reference for the optimization of process parameters of diamond wheel grinding SiCp/A1 com- posites.
Keywords:Abaqus  diamond abrasive particle  SiCp/A1 composites  simulation  grinding force  surface topogra-phy  residual stress
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