高层印制线路板正面临的对位挑战

封装工业正在推动着印制线路板技术水平朝着半导体要求的方向发展。高密度印制线路板正广泛用于网络路由器、自动测试设备和服务器领域。高密度要求(>150 IO/cm~2)正成为客户的普通需求。为满足现有的高密度封装要求,由于线宽、线距和通孔孔径正接近传统制作极限,普遍的方法就是不断增加印制线路板的层数。这些特征正驱动着印制线路板在基材、图像转移、蚀刻、电镀、阻焊、测试流程和对位系统的变化。此文主要讲述了印制线路板特性的变化趋势和利用对位模式和雷利分布去预测满足高级对位要求的能力以及印制线路板各流程中有关对准度的控制要点。

Meeting the Registration Challenges for High Layer Count PCB's

The packaging industry is 'pulling' the primed circuit board (PCB) technology level in the direction of semiconductor requirements. High density PCB's are becoming commonplace in the network routers, automated test equipment, and server sectors. The need for the high density (>150 IO/cm~2) is becoming a common requirement. In order to fan out the high density packages, many layers are being added as finer lines, spacing and via diameters are approaching conventional manufacturing limits. These attributes are driving changes in base materials, imaging, etching, plating, soldermask, testing processes, and registration systems. This paper examines trends in PCB attributes and utilizes a registration model and the Rayleigh distribution to predict capability for advanced registration requirements and lists some critical registration control points.