| 高温压力传感器的热模拟 |
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| 引用本文： | 耿青涛,孙以材,王云彩. 高温压力传感器的热模拟[J]. 传感器世界, 2008, 14(1): 17-20 |
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| 作者姓名： | 耿青涛 孙以材 王云彩 |
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| 作者单位： | 河北工业大学,300130;河北工业大学,300130;河北工业大学,300130 |
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| 摘 要： | 探讨了一种多晶硅高温压力传感器的设计方法，论述了其较一般高温压力传感器的优点及其制造工艺流程。重点利用ANSYS软件对模型进行了热模拟，比较了AIN，SiO2与Al2O3分别作为绝缘散热层时模型中的温度分布，并且比较了散热层不同厚度时力敏电阻中心点的温度。
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| 关 键 词： | ANSYS 高温压力传感器 有限元分析 热模拟 |
| 文章编号： | 1006-883X（2008）01-0017-04 |
Thermal Simulation Of High-Temperature Pressure Sensor |
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| Abstract: | A design method of polysilicon high-temperature pressure sensor was demonstrated. Compared with other high-temperature pressure sensors and their fabrication process, the advantages of the polysilicon high-temperature pressure sensor were discussed. The temperature distribution in the model were simulated essentially by using ANSYS software, respectively the temperature distribution performances are compared among AIN, SiO2, Al2O3 which being as heat dispersion-layer, and the temperatures at resistor center are presented in different thickness of these heat dispersion-layers. |
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| Keywords: | ANSYS high-temperature pressure sensors finiteelement analysis（FEA） thermal simulation, EEACC：2550 |
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