退火对冷轧Cu-Ag合金组织及性能的影响

采用扫描电镜、透射电镜、拉伸试验机和热电性能分析系统等研究了退火对Cu-24%Ag合金显微组织、力学性能以及电学性能的影响,通过构建电子界面散射模型对合金导电机制进行了研究。结果表明,通过退火对Cu-24%Ag合金的显微组织进行了有效调控,改善了其综合性能。与冷轧态相比,合金经350 ℃退火1 h后,抗拉强度下降至冷轧态的95%,合金导电率提升了4%IACS。经450 ℃退火1 h,由于Ag纤维的溶解,合金的抗拉强度显著下降,只有冷轧态的一半左右;Ag纤维的溶解降低了电子的散射几率,使得导电率大幅度提升。因此,合金在350 ℃退火1 h后综合性能最佳,其抗拉强度和导电率分别为622 MPa和81%IACS。

Effect of annealing on microstructure and properties of cold-rolled Cu-Ag alloy

Effect of annealing on microstructure, mechanical properties and electrical properties of the Cu-24%Ag alloy was studied by means of scanning electron microscope, transmission electron microscope, tensile testing and thermoelectric performance analysis system. The conduction mechanism of the alloy was studied by constructing an electron interface scattering model. The results show that the microstructure of the Cu-24%Ag alloy is effectively controlled by annealing, and the comprehensive properties are improved. The tensile strength of the alloy decreases to 95% of that of the cold-rolled alloy and the conductivity increases by 4%IACS after annealing at 350 ℃ for 1 h. After annealing at 450 ℃ for 1 h, the tensile strength decreases significantly and is only about half of that of the cold-rolled alloy due to the dissolution of Ag fibers. In addition, the dissolution of Ag fibers reduces the scattering probability of electrons and improves the conductivity. Therefore, the Cu-24%Ag alloy annealed at 350 ℃ for 1 h has the best comprehensive properties, of which the tensile strength and conductivity are 622 MPa and 81%IACS, respectively.