放电等离子烧结CuIn5合金的工艺优化

采用正交试验法确定了CuIn₅合金放电等离子烧结(SPS)的最佳工艺参数,研究了烧结温度、烧结时间、烧结压力对CuIn₅合金的致密度、硬度和导电性能的影响。结果表明:影响CuIn₅合金致密度和硬度的主要因素均为烧结温度,其次为烧结压力,烧结时间的影响最小;影响CuIn₅合金电导率的主要因素为烧结温度,其次为烧结时间和烧结压力。利用SPS技术制备CuIn₅合金的最佳工艺为烧结温度850 ℃,烧结时间5 min,烧结压力50 MPa。采用最佳工艺制备的CuIn₅合金组织均匀致密,In固溶于Cu中形成固溶体,其晶格常数为0.362 865 nm,晶格畸变率为0.38%,致密度为99.56%,显微硬度为136.3 HV0.1,导电率为37.86%IACS。

Process optimization of CuIn5 alloy prepared by sparking plasma sintering

Optimum parameters of spark plasma sintering (SPS) process of CuIn₅ alloy were determined by orthogonal experiment. The effect of sintering temperature, sintering time and sintering pressure on density, hardness and electrical conductivity of the CuIn₅ alloy was studied. The results show that the main factor affecting density and hardness of the CuIn₅ alloy is sintering temperature, followed by sintering pressure, and sintering time has the least effect; the main factors affecting the conductivity of the CuIn₅ alloy is sintering temperature, followed by sintering time and sintering pressure. The optimum process for preparing CuIn₅ alloy by SPS process consists of sintering temperature of 850 ℃, sintering time of 5 min and sintering pressure of 50 MPa. The microstructure of CuIn₅ alloy prepared by the best process is uniform and compact, In is dissolved in Cu to form a solid solution, the lattice constant is 0.362 865 nm, the lattice distortion is 0.38%, the density is 99.56%, the microhardness is 136.3 HV0.1, and the conductivity is 37.86%IACS.