Reliability of AuGe/Pt and AuGe/Ni ohmic contacts on GaAs |
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| Authors: | Lee CP Welch BM Fleming WP |
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| Affiliation: | Rockwell International, Microelectronics Research & Development Center, Thousand Oaks, USA; |
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| Abstract: | The reliability of AuGe/Pt and AuGe/Ni ohmic contacts with and without overlay metal (Ti/Au, Ti/Pt/Au or TiW/Au) has been studied. AuGe/Ni contacts have proved superior and more reliable than AuGe/Pt contacts with or without overlay. AuGe/Pt contacts are stable without overlay but degrade rapidly with overlay. AuGe/Ni contacts exhibit thermal stability after 1000 hours' aging at 250°C. |
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