高压大功率IGBT器件温度系数校准方法研究

结温的准确测量对于功率IGBT器件状态监测和可靠性评估具有重要意义，小电流下饱和压降法作为使用最广泛的结温测量方法被各类测试标准推荐使用，温度系数校准是使用该方法的第一步，也是结温测量的基础。传统的温度系数校准方法对于高压大功率IGBT器件存在适用性和准确性的问题。首先，深入讨论和对比了目前常用的2种温度系数校准系统的精度，并提出了一种基于电磁加热方式的温度系数校准系统，并对其精度进行了验证；其次，对温度系数校准曲线的非线性进行了讨论和分析，指出了全温度范围校准和多项式拟合的必要性，进一步补充了温度系数校准方法，为高压大功率IGBT器件的温度系数校准提供方法指导。

Calibration Methods for Junction Temperature Measurement of High Power IGBT Modules

The accuracy junction temperature measurement is of great significance for condition monitoring and reliability assessment of power IGBT devices. The junction temperature measurement method using saturation voltage drop at small current is the most widely used method and is recommended by various test standards. Calibration is the first step of this method and also the basis of junction temperature measurement. The traditional calibration method has the problem of applicability and accuracy for high power IGBT modules. Firstly, the accuracy of two commonly used calibration systems is discussed and compared, and a new calibration system based on electromagnetic heating is proposed, and its accuracy is verified by experiment. Secondly, the non-linearity of calibration curve is discussed and analyzed, and the necessity of calibration at full temperature range and polynomial fitting is pointed out, which further complements the calibration method. This paper can provide a methodology guidance for calibration of high power IGBT modules.