| 先进的芯片尺寸封装(CSP)技术 |
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| 引用本文： | 杜润. 先进的芯片尺寸封装(CSP)技术[J]. 电子工业专用设备, 2006, 35(9): 36-42 |
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| 作者姓名： | 杜润 |
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| 作者单位： | 半导体行业协会封装分会,北京,100083 |
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| 摘 要： | 随着手机、掌上电脑、薄形笔记本等消费类电子产品的迅速发展,芯片尺寸封装技术(CSP)在我国从无到有,并在短短几年时间内取得了突飞猛进的发展。论述了芯片尺寸封装(CSP)的7大特点,总结了6大类别,归纳了主要生产制作工艺,并对我国芯片尺寸封装技术(CSP)的发展提出了几点建议。
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| 关 键 词： | 芯片尺寸封装 LSI芯片 凸点 |
| 文章编号： | 1004-4507(2006)08-0037-07 |
| 收稿时间： | 2006-07-20 |
| 修稿时间： | 2006-07-20 |
Advanced Chip Scale Package Technology |
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| DU Run. Advanced Chip Scale Package Technology[J]. Equipment for Electronic Products Marufacturing, 2006, 35(9): 36-42 |
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| Authors: | DU Run |
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| Affiliation: | Beijing Office Packaging Branch, CSIA 100083, China |
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| Abstract: | with the development of mobile telephone, PDA and lamellar notebook PC, the great development of Chip Scale Package Technology has been occurred in our country recently. In this article, introduces 7 characteristics, 6 sorts and mainly manufacturing approaches of CSP, and give advice on the development of CSP on our country. |
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| Keywords: | Chip Scale Package Large Scale Integrated Circuit Bump |
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