C-19 diacid-based polyamides |
| |
| Authors: | Lawson N E Cheng T T |
| |
| Affiliation: | (1) Union Camp Corporation, Research and Development Division, PO Box 412, 08540-0412 Princeton, NJ |
| |
| Abstract: | The preparation and properties of polyamide hot-melt adhesives derived from Koch C-19 diacid are described. They are comparable
to those of commercial C-36 dimer acid-based polyamides for bonding leather and metals and somewhat superior to those of polyamides
made from C-19 diacid derived from a hydroformylation process.
Presented at the AOCS annual meeting, Toronto, May 1982. |
| |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ |
|
