| 柔性AMOLED的技术现状与进展 |
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| 引用本文： | 敖银辉,高健. 柔性AMOLED的技术现状与进展[J]. 现代电子技术, 2011, 34(3): 197-200 |
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| 作者姓名： | 敖银辉 高健 |
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| 作者单位： | 广东工业大学,机电工程学院,广东,广州,510090 |
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| 摘 要： | 目前已经有商业化的AMOLED产品应用在MP3、手机上，而采用柔性基板的AMOLED也正在研制中，但真正实现商业化还面临诸多技术难题，如柔性衬底处理技术，柔性基板的TFT制备方法，有机薄膜蒸镀和薄膜封装等。具体分析了相关问题的处理方法和技术现状。指出使用塑胶衬底，开展有机氧化物TFT制备的发展思路。提示我国在有机薄膜蒸镀和薄膜封装领域有较大的潜在机会。
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| 关 键 词： | 有源矩阵有机发光二极管 柔性衬底 薄膜蒸镀 薄膜封装 |
Technical Challenge and Development of Flexible AMOLED |
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| AO Yin-hui,GAO Jian. Technical Challenge and Development of Flexible AMOLED[J]. Modern Electronic Technique, 2011, 34(3): 197-200 |
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| Authors: | AO Yin-hui GAO Jian |
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| Affiliation: | AO Yin-hui,GAO Jian(Mechanical and Electrical Engineering Department,Guangdong University of Technology,Guangzhou 510090,China) |
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| Abstract: | The commercial AMOLED products have been used in MP3 and mobile phones.The flexible AMOLED is being developed now,but it faces many technical challenges such as flexible substrate treatment,TFT backplane technology,thin film evaporation and encapsulation.The technical challenge and development of related problems are analyzed.The flexible polymer substrate,organic TFT backplane and multi-thin film encapsulation were suggested for the next research. |
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| Keywords: | AMOLED flexible substrate thin film evaporation thin film encapsulation |
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