| 半导体制造中清洗技术的新动向 |
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| 引用本文： | 许宝兴. 半导体制造中清洗技术的新动向[J]. 电子工业专用设备, 2005, 34(7): 1-6,10 |
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| 作者姓名： | 许宝兴 |
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| 作者单位： | 中国电子科技集团公司第二研究所,山西,太原,030027 |
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| 摘 要： | 多年来习惯采用多槽浸渍式RCA清洗的半导体清洗领域里,正在兴起的是从多槽浸渍式向单片式处理转移。并出现了取代RCA法的新型清洗液与新的生产方法。正在开始对超临界流体清洗等下一代清洗技术的开发。概述这些半导体清洗技术的最新动向。
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| 关 键 词： | 半导体制造 清洗技术 晶圆 |
| 文章编号： | 1004-4507(2005)07-0001-06 |
The Present Trend of Cleaning Technology in Semiconductor Manufacturing |
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| XU Bao-xing. The Present Trend of Cleaning Technology in Semiconductor Manufacturing[J]. Equipment for Electronic Products Marufacturing, 2005, 34(7): 1-6,10 |
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| Authors: | XU Bao-xing |
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| Abstract: | Multi-tank immersion cleaning has been used in semiconductor cleaning for many years. Now single wafer process will spring up. New cleaning liquid and production method has come up, and in place of RCA. The next cleaning technology of super critical fluid cleaning is under development. This article summrizes the new trends of semi conductor cleaning. |
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| Keywords: | Semiconductor manufacturing Cleaning technology Wafer |
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