树脂基复合材料固化过程中的温度和热应力场三维瞬态分析

建立了热固性树脂基复合材料固化过程温度和热应力场分析的数学模型,采用有限元方法,进行了三维非稳态数值求解。通过与已有实验结果的比较,验证了数学模型和计算方法的正确性。获得了3234/T300层合板固化过程中内部温度及热应力分布,分析了保温时间、升温速率、铺层设计等对温度、内部热应力的影响。数值计算结果表明:预固化时间越长,层合板内温度梯度越小,热应力峰值越低;升温速率越大,层合板内温度梯度越大,热应力峰值越大;采用对称铺层可降低层合板内部温度梯度和热应力。

3D Unsteady Analysis of Temperature and Thermal Stress Fields of Resin Matrix Composite during Curing Process

A three-dimensional unsteady finite element analysis model is developed for the simulation of the temperature and thermal stress fields of the thermosetting resin matrix composite laminate during the curing process. The correctness of the numerical model and methodology is verified by comparing with the available experimental results. The distributions of temperature and thermal stress in 3234/T300 composite laminates during curing process are numerically predicted. The effects of the pre-curing time, heating rate and the stacking sequence on the temperature and thermal stress fields during curing process are analyzed. The numerical computation. results indicate that the temperature gradient and thermal stress in the laminates decrease with the increasing pre-curing time and decreasing heating rate. Using symmetrical stacking sequence can also decrease the temperature gradient and thermal stress in composite laminates.