基片集成波导技术:最新的发展和未来的展望

回顾了基片集成波导技术(SIW)最新的发展动态。到目前为止,所报道的各种各样基于基片集成波导技术的无源和有源元器件已经证明,它们能够被有效地集成为低成本基片片载系统(SoS),为封装系统提供了完整的解决方案。讨论了不同的创新型基片集成波导的波束形成技术,展望了未来的发展方向,提出了将基片集成电路扩展到三维空间以及在相同的基片构建模块上将不同的波导结构进行混合集成的思想,描述了用于毫米波和太赫兹应用的基片集成波导技术其它的发展趋势,这包括非线性和有源波导的开发以及基于CMOS技术的波导合成。

Substrate Integrated Waveguide (SIW) Techniques: The State-of-the-Art Developments and Future Trends

The state-of-the-art developments of substrate integrated waveguide (SIW) techniques is overviewed. Various SIW-based passive and active components reported so far have demonstrated that they can be effectively integrated in the form of low-cost system-on-substrate (SoS), which provides complete packaged system solutions. Different innovative SIW beam-forming techniques are discussed. Future developments are forecasted, which suggest the expansion of substrate integrated circuits (SICs) into 3-D geometry and mixed integrations of dissimilar waveguides within the same substrate building blocks. Other SIW-related trends are also described, including non-linear and active waveguide developments as well as CMOS-based waveguide synthesis for millimeter-wave and THz applications.