| 三维电子装联工艺文件设计方法 |
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| 引用本文： | 陈颖芳.三维电子装联工艺文件设计方法[J].电子测试,2020(10):123-124. |
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| 作者姓名： | 陈颖芳 |
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| 作者单位： | 中国电子科技集团公司第三十四研究所 |
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| 摘 要： | 本文为了提升三维电子装联工艺信息表达的效果,构建了工艺规程树,对工艺设计了规程包,并进行了封装,以更好地构建基于工艺规程树的电子装联工艺文件的设计方法。
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| 关 键 词： | 电子装联工艺 三维模型 文件设计 |
Design method of 3D electronic assembly process document |
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| Chen Yingfang.Design method of 3D electronic assembly process document[J].Electronic Test,2020(10):123-124. |
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| Authors: | Chen Yingfang |
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| Affiliation: | (The 34th Research Institute of China Electronic Technology Corporation,Guilin Guangxi,541004) |
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| Abstract: | This paper constructs a process planning tree,designs a process planning package and encapsulates it,so as to better build a design method of electronic assembly process documents based on the process planning tree. |
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| Keywords: | electronic assembly process 3D model document design |
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