密封元器件水汽含量时效变化研究

聚合物材料作为一种芯片粘接材料,被广泛使用在各类元器件中,具有操作过程简单,不依赖表面金属化等优点,适用于多芯片、小尺寸、绝缘等复杂环境。但聚合物粘接剂具有缓慢释放气氛的性质,长时间使用下的密封腔体内部气氛变化与控制是行业内研究的重点。研究高温贮存环境和温度循环环境中,不同时间变量下,聚合物粘接芯片的密封电路内部气氛变化情况,并与在常温环境长时间静置电路气氛测量结果进行对比分析,得到加速条件与常规静置条件之间的换算关系参考值,为后续聚合物粘接可靠性的研究提供依据。

Study of Hermetic Components Internal Moisture Aging Process

As a kind of chip bonding material, polymer material is widely used in all kinds of components. It has the advantages of simple operation process, independent of surface metallization, etc,suitable for multi-chip, small size, insulation and other complex environments. However, the polymer adhesive has the property of slowly releasing atmosphere, and the change and control of the atmosphere inside the sealed cavity after long-term use is the focus of research in the industry. The change of atmosphere in the sealed circuit of polymer bonded chip under different time variables in high temperature storage environment and temperature cycling environment is studied, and compared with the measurement results of circuit atmosphere standing for a long time in normal temperature environment, the reference value of conversion relation between accelerated condition and conventional standing condition is obtained, which provided the basis for subsequent research on polymer bonding reliability.