应用于激光雷达信号处理系统的放大电路接口设计

应用于激光雷达(LiDAR)测量系统的单芯片全集成信号处理电路系统的设计与实现，对于有效提高激光雷达整机测量精度、数据率，缩短测量时间，减小测量设备体积和功耗具有重要的意义。考虑到目前对于信号处理电路系统的研究中较少考虑芯片在实际使用环境中的接口问题，基于光电探测器、裸芯片、封装、传输线及测试板等诸多接口影响因素，运用协同仿真分析的方法，在电路系统的实际工作频段内，建立了一种精确的、能反映激光雷达信号处理电路系统放大电路芯片真实应用环境的接口一体化仿真模型，并通过S参数仿真对其进行验证。同时基于CMOS工艺，将设计得到的放大电路系统进行流片，在芯片输入端承载不同光电探测器寄生负载的情况下，对芯片性能进行测试，仿真结果与测试结果吻合较好，验证了该接口模型建立的可行性。

Amplifying Circuit Interface Model for LiDAR Signal Processing Systems

The monolithic signal processing circuit system for Light Detection And Ranging (LiDAR) measurement has significant practical values in terms of improving LiDAR measurement accuracy and data rate, shortening measurement time, and reducing equipment size and power consumption. As the environment interface problem is less considered, the appropriate input interface model must be established to break through the technology difficulty to associate circuit system with photodetectors, die chip, package, transmission line, test board and so on in the operating frequency range. By the combination of theoretical analysis and model simulation, the real working environment of circuit systemfor LiDAR signal processing can be simulated reasonably. Furthermore, based on CMOS technology, the signal processing circuit chip is tested with different photodetector parasitic capacitances. The well agreements between simulation and the testing results validate the feasibility of the input interface model.