Wafer-level BCB bonding using a thermal press for microfluidics |
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Authors: | Xiaodong Zhou Selven Virasawmy Chenggen Quan |
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Affiliation: | (1) Institute of Materials Research and Engineering, A*STAR (Agency for Science, Technology and Research), 3 Research Link, Singapore, 117602, Singapore;(2) Department of Mechanical Engineering, National University of Singapore, 9 Engineering Drive 1, Singapore, 117576, Singapore |
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Abstract: | Benzocyclobutene (BCB) is a thermosetting polymer that can form microfluidics and bond top and bottom layers of the microfluidics
at the same time, and yields high repeatability and high bonding strength. This paper reports using photosensitive BCB to
fabricate microfluidics and to bond with a thermal press for 4 in. wafers. By optimizing the parameters for pattern development
and using a three-stage temperature and pressure increment BCB bonding, we realize the whole wafer glass–Si or glass–glass
bonding in thermal press without any crack. The wafer-level bonding shows a bonding percentage above 70%, a tensile stress
above 4.94 MPa, and a bonding repeatability over 95%. Furthermore, the bonding is compatible with thick electrode integration,
that microfluidics with 380 nm thick electrodes underneath can be well-bonded. Our bonding method much reduces the cost compared
with bonding BCB in a wafer bonding machine.
Electronic supplementary material The online version of this article (doi:) contains supplementary material, which is available to authorized users. |
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