首页 | 本学科首页   官方微博 | 高级检索  
     


Synthesis and characterization of organo‐soluble polyimides derived from a new spirobifluorene diamine
Authors:Guo‐Min Jiang  Xue Jiang  You‐Fu Zhu  Dan Huang  Xiao‐Hui Jing  Wei‐Dong Gao
Affiliation:1. Key Laboratory of Eco‐Textile (Jiangnan University), Ministry of Education, Wuxi 214112, China;2. School of Chemistry and Chemical Engineering, Nantong University, Nantong 226007, China
Abstract:Polyimides exhibit outstanding thermal and thermo‐oxidative stability, excellent solvent resistance, good mechanical and electrical properties and superior chemical resistance. However, their practical applications are frequently limited by their infusible and insoluble nature. Structural modifications of the polymer backbone have been utilized to modify polyimide properties, either by reducing the interaction or by reducing the stiffness of the polymer backbone. Novel organo‐soluble polyimides containing spirobifluorene units were synthesized by the polycondensation of 2,7‐bis‐amino‐2′,7′‐di‐t‐butyl‐9,9′‐spirobifluorene with three aromatic dianhydrides. The one‐step polymerization procedure was conducted at 200 °C in m‐cresol, and the structures of the resulting polyimides were confirmed using infrared and NMR spectroscopy. The weight‐average molecular weights and polydispersities of the resulting polymers were in the ranges 20 600–341 000 and 1.02–1.30, respectively. The glass transition temperatures of the polyimides were in the range 289–322 °C, and the 10% weight loss in nitrogen appeared at a temperature higher than 435 °C and the residual weight at 800 °C was above 58%. The spiro segment has been introduced into polyimides, resulting in amorphous polyimides, conferring on them an enhanced solubility and leading to a significant increase in both glass transition temperature and thermal stability. These types of materials have potential for many applications. Copyright © 2010 Society of Chemical Industry
Keywords:polyimides  spirobifluorene  organo‐soluble  amorphous  thermal stability
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号