一种多芯片封装(MCP)的热仿真设计

集成电路封装热设计的目的在于尽可能地提高封装的散热能力,确保芯片的正常运行。多芯片封装(MCP)可以提高封装的芯片密度,提高处理能力。与传统的单芯片封装相比,由于包含多个热源,多芯片封装的热管理变得更为关键。本文针对一种2维FBGAMCP产品,进行有限元建模仿真,并获得封装的热性能。通过热阻比较的方式,分析了不同的芯片厚度对封装热性能的影响。针对双芯片封装,通过对不同的芯片布局进行建模仿真,获得不同的芯片布局对封装热阻的影响。最后通过封装热阻的比较,对芯片的排列布局进行了优化。分析结果认为芯片厚度对封装热阻的影响并不明显,双芯片在基板中心呈对称排列时封装的热阻最小。

Thermal Simulation and Design of a Multi-Chip Package

Thermal design of the IC package is to improve the thermal dissipation ability of the package.Multi chip-package(MCP) is designed to increase the density of integrated electronics and improve the processing power.Due to the multi-heat sources in a package,heat management becomes more critical for MCPs.This paper presents the finite elements simulation of FBGA MCP product.The effect of chip thickness to the thermal resistance of the package is presented.Through a comparison of the thermal performances,the chip placement is optimized.The simulation results show that chip thickness does not have a profound effect to the thermal resistance of MCPs,and the smallest thermal resistance is obtained when the two chips are symmetrically arranged in the center of the substrate.