| 积层多层板用新型绝缘材料 |
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| 引用本文： | 祝大同. 积层多层板用新型绝缘材料[J]. 化工新型材料, 2001, 29(1): 11-15 |
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| 作者姓名： | 祝大同 |
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| 作者单位： | 北京绝缘材料厂 |
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| 摘 要： | 本文主要综述了近年国外积层多层板所用绝缘基板材料的品种、性能等方面的现状与发展。
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| 关 键 词： | 积层多层板 绝缘材料 树脂 |
| 修稿时间： | 2000-10-13 |
INSULATING MATERIAL FOR BUILD-UP MULTILATIYER PRINTED BOARD |
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| Zhu Datong. INSULATING MATERIAL FOR BUILD-UP MULTILATIYER PRINTED BOARD[J]. New Chemical Materials, 2001, 29(1): 11-15 |
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| Authors: | Zhu Datong |
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| Abstract: | The new application of insulating base material in Japan to build up multilatiyer printed board was reviewed in this paper,and the situation and development on the varieties and properties were also described. |
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| Keywords: | build up multilayer printed board insulating material resin |
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