| 声表面波器件内连技术的发展趋势探讨 |
| |
| 引用本文： | 吴燕,王文如.声表面波器件内连技术的发展趋势探讨[J].压电与声光,2001,23(1):5-7. |
| |
| 作者姓名： | 吴燕 王文如 |
| |
| 作者单位： | 四川压电与声光技术研究所, |
| |
| 摘 要： | 随着SAW器件向小型化、轻型化的发展，传统的引线键合技术已对其形成严重制约。倒装焊技术在30年前发展起来，它解决了器件小型化发展的问题，并与平行封焊等工艺手段一起，促进了表面贴装技术（SMT）的发展，也越来越多地用于其他工业中。文章介绍了传统线焊工艺的局限性，倒装焊工艺的核心技术以及对面临的困难可能的解决方法。
|
| 关 键 词： | 线焊 倒装焊 声表现波器件 内连技术 |
| 文章编号： | 1004-2474（2001）01-0005-03 |
| 修稿时间： | 2000年7月23日 |
Discussion on Development Tendency of SAW Device Interconnection |
| |
| WU Yan,WANG Wen ru.Discussion on Development Tendency of SAW Device Interconnection[J].Piezoelectrics & Acoustooptics,2001,23(1):5-7. |
| |
| Authors: | WU Yan WANG Wen ru |
| |
| Abstract: | As SAW filters becoming smaller and lighter,the general wire bond has imposed restrictions on its development.Developed 30 years ago,flip chip bond technique not only solved the problem of miniaturization but helped the development of surface mount technology(SMT) with other process,such as parallel weld technique.Now it is used in other industries more and more.The limitation of the traditional wire bond,the key technology and possible solutions to problems of flip chip bond are also introduced in this paper. |
| |
| Keywords: | wire bond flip chip bond bump controlled collapse chip connection |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
