| 高性能PCB基体树脂的研究进展 |
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| 引用本文： | 孟季茹,梁国正,赵磊,秦华宇.高性能PCB基体树脂的研究进展[J].材料导报,2001,15(6):55-57. |
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| 作者姓名： | 孟季茹 梁国正 赵磊 秦华宇 |
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| 作者单位： | 西北工业大学化学工程系, |
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| 摘 要： | 概述了目前用于高性能印刷电路板的几种新型基体树脂，介绍了它们的发展方向和应用前景。
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| 关 键 词： | 印刷电路板 介电性能 耐热性 吸湿率 热膨胀系数 基体树脂 性能 PTFE PPO MPPO CE BT PZ |
Progress in Research on Matrix Resins for High Performance Printed Circuit Board |
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| Meng Jiru Liang Guozheng Zhao Lei Qin Huayu.Progress in Research on Matrix Resins for High Performance Printed Circuit Board[J].Materials Review,2001,15(6):55-57. |
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| Authors: | Meng Jiru Liang Guozheng Zhao Lei Qin Huayu |
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| Abstract: | Several major new matrix resins for high performance PCB are reviewed in this paper,at the same time,future rescarch directions and possibilities of their application are also discussed. |
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| Keywords: | PCB dielectrie property thermal stability moisture absorption CTE |
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