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SnAgCu合金粉末的真空蒸镀涂层机理
引用本文:马运柱, 崔鹏, 刘文胜, 彭芬, 黄国基. SnAgCu合金粉末的真空蒸镀涂层机理[J]. 工程科学学报, 2011, 33(2): 188-192. DOI: 10.13374/j.issn1001-053x.2011.02.010
作者姓名:马运柱  崔鹏  刘文胜  彭芬  黄国基
作者单位:1.中南大学粉末冶金国家重点实验室, 长沙 410083
摘    要:对SnAgCu合金粉末的真空蒸镀涂层硬脂酸的成膜机理进行了研究.采用扫描电镜(SEM)和透射电镜(TEM)对涂覆后合金粉末的形貌及结构进行观测,采用傅里叶红外光谱仪(FTIR)和X射线光电子能谱仪(XPS)对涂覆后粉末的透射吸收谱和光电子能量进行测试.结果表明:硬脂酸在合金粉末表面形成一层均匀致密、厚度为5~10 nm的薄膜,硬脂酸涂层SnAgCu合金粉末的行为属于物理吸附行为,其生长方式遵循岛状生长机理模式,其过程实质是一个气-固转换、晶体生长的过程.

关 键 词:封装材料  电子封装  粉末  硬脂酸  薄膜  吸附  真空蒸镀
收稿时间:2010-03-30

Film formation mechanism of coated SnAgCu alloy powders via vacuum evaporation
MA Yun-zhu, CUI Peng, LIU Wen-sheng, PENG Fen, HUANG Guo-ji. Film formation mechanism of coated SnAgCu alloy powders via vacuum evaporation[J]. Chinese Journal of Engineering, 2011, 33(2): 188-192. DOI: 10.13374/j.issn1001-053x.2011.02.010
Authors:MA Yun-zhu  CUI Peng  LIU Wen-sheng  PENG Fen  HUANG Guo-ji
Affiliation:1.State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China
Abstract:The film-forming mechanism of stearic acid modified SnAgCu alloy powders by vacuum evaporation was researched. Scanning electronic microscope (SEM) and transmission electronic microscope (TEM) were used to observe the morphology and structure of the coated powders. Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS) were adopted to test the transmission absorption spectrum and photoelectron energy of the coated powders. The results indicate that uniform and compact coatings whose thickness was 5 to 10 nm could be obtained. The growth mechanism of stearic acid coatings on SnAgCu alloy powders was a process of physical adsorption and followed the Volmer-Weber model. The essence of the process was the transformation between vapor and liquid and the growth of crystals.
Keywords:packaging materials  electronics packaging  powders  stearic acid  thin films  adsorption  vacuum evaporation
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