Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling |
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| Authors: | S Jacques A Caldeira N Batut A Schellmanns R Leroy L Gonthier |
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| Affiliation: | 1. STMicroelectronics, 16 rue Pierre et Marie Curie, BP 7155, 37071 Tours Cedex 2, France;2. Power Microelectronics Laboratory (LMP), Tours University, France;3. Mechanics and Rheology Laboratory (LMR), Tours University, France |
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| Abstract: | In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (ΔTcase) is the main acceleration factor, the solder joints are the weakest materials in the non-insulated TO-220AB TRIAC package and the plastic strain within the solder layer due to shearing is the failure cause. |
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