Preliminary assessment of the stability of thin- and polymer thick-film resistors embedded into printed wiring boards |
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| Authors: | Wojciech St?plewski Tomasz Serzysko Gra?yna Kozio? Andrzej Dziedzic |
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| Affiliation: | 1. Tele and Radio Research Institute, Centre of Advanced Technology, Ratuszowa 11, 03-450 Warsaw, Poland;2. Wroc?aw University of Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11/17, 50-372 Wroc?aw, Poland |
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| Abstract: | Embedding passive components into multilayer printed wiring boards (PWBs) meet electronic device requirements concerning the necessity of saving the surface board area for active elements, reducing board’s size, improving device functionality and safety as well as overall product cost reduction. Since embedded components cannot be replaced after the board is completed, a long term stability and reliability are the important concerns for manufactures.This paper presents the results of examinations of embedded thin-film NiP resistors and polymer thick-film resistors during their continuous operation and the influence of temperature on the resistance values after the simulation of a lead-free soldering process and after the temperature cycling test (?40 ?C/+85 ?C). |
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