Microstructure and mechanical properties of Sn–Zn–Bi–Cr lead-free solder |
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Authors: | Tingbi Luo Anmin Hu Jing Hu Ming Li Dali Mao |
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Affiliation: | State Key Lab Met Matrix Composites, Key Laboratory for Thin Film and Microfabrication of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China |
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Abstract: | In this paper, the effect of trace addition of Cr on the mechanical properties and reliability on Sn–8Zn–3Bi solder alloys was investigated. It has been demonstrated that the microstructure of solder alloys was refined after doping traces of Cr. The elongation reaches up to 40.63% after doping 0.1% Cr; and the fracture mechanism converts from quasi-cleavage fracture into ductile fracture. With aging time of 0, 4, 9 and 16 days, mechanical property of Sn–8Zn–3Bi–0.3Cr alloy was improved slightly. It was found that the Sn–Zn–Cr phase was increased and Zn in alloy was consumed after aging, so that the amount of primary Zn phase was reduced and microstructure was improved. |
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