Effects of He (90%)/H2 (10%) plasma treatment on electric properties of low dielectric constant SiCOH films |
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Authors: | Hoonbae Kim Myung Hoon Ha Donggeun Jung Heeyeop Chae Hyoungsub Kim |
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Affiliation: | 1. Innovent e.V. Technology Development, Department of Surface Engineering, Prüssingstr. 27B, 07745 Jena, Germany;2. University of Jena, Institute for Solid State Physics, Helmholtzweg 3/5, 07745 Jena, Germany;1. Heat Treatment and Surface Engineering R&D Group, Korea Institute of Industrial Technology, Incheon 406-840, Republic of Korea;2. Department of Physics, Sungkyunkwan University, Suwon 440-746, Republic of Korea |
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Abstract: | In microelectronics industry, integration of the low dielectric constant (low-k) material films is a continuing issue due to the decreasing device feature size. To improve electric properties, various post-deposition treatments of the low-k material films can be used. In this work, we used room temperature treatment of He/H2 plasma and investigated the effects of plasma treatment on the electrical properties of low-k SiOCH films. Plasma treatment time changed from 300 to 1800 s. After treatment, the dielectric constant was decreased from 2.9 to 2.48, and the thickness of the low-k SiCOH films changed by only ~5%. The leakage current densities of the low-k SiCOH films were decreased to ~10?11 A/cm2, with treatment time ≥600 s. The breakdown occurred only around 2 V for films plasma-treated for 600 and 900 s. However, for 1800 s treatment time, the breakdown voltage was enhanced dramatically and breakdown occurred at applied voltage higher than 40 V. The surface composition change of the films after treatment was investigated by X-ray photoelectron spectroscopy (XPS). As the plasma treatment time was increased, the intensities of C C/C H and C Si peaks were decreased while the intensities of Si O and C O peaks were increased. It is thought that increase of oxygen content of the SiCOH film, after plasma treatment, contributed to leakage current reduction and breakdown voltage increase. |
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