High power LED package with vertical structure |
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| Authors: | Ming-Te Lin Shang-Ping Ying Ming-Yao Lin Kuang-Yu Tai Jyh-Chen Chen |
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| Affiliation: | 1. Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Rm. 206, Bldg. 78, 195, Sec. 4, Chung-Hsing Road, Chutung, Hsinchu 310, Taiwan, ROC;2. Department of Mechanical Engineering, National Central University, Chung-Li 320, Taiwan, ROC;3. Department of Optoelectronic System Engineering, Minghsin University of Science & Technology, 1, Hsin-Hsing Road, Hsin-Fong, Hsinchu 30401, Taiwan, ROC |
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| Abstract: | A LED package structure with vertical geometry of W5II is proposed for high power optoelectronic semiconductor devices. To provide an efficient and easy method of assembling high-power LEDs to sockets of the fixtures, a vertical design referenced from the typical Edison screw base found in US-based lamp systems is used in the structure. The thermal simulation of the structure, fabrication processes and thermal characteristic are evaluated. Thermal resistance measurements are performed to characterize the thermal performance of W5II, and the optical and electrical characteristics of W5II are also verified. The good heat dissipation of W5II could be utilized to enhance the reliability and thermal fatigue capability of high-power LED packages. |
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