| CPU散热片挤压过程的数值模拟及模具优化 |
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| 引用本文： | 和优锋,谢水生,程磊,黄国杰,付垚. CPU散热片挤压过程的数值模拟及模具优化[J]. 锻压技术, 2009, 34(4). DOI: 10.3969/j.issn.1000-3940.2009.04.032 |
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| 作者姓名： | 和优锋 谢水生 程磊 黄国杰 付垚 |
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| 作者单位： | 北京有色金属研究总院,有色金属材料制备加工国家重点实验室,北京,100088 |
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| 基金项目： | “十一五”国家科技支撑计划(2007BAE38B00) |
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| 摘 要： | 采用刚粘塑性有限元法,利用Deform-3D有限元软件实现了铝合金CPU散热片导流模挤压过程的数值模拟。获得了挤压过程中材料的流动规律、挤压力、模具应力以及模具出口处流速的分布。通过数值模拟发现,型材出口流速很不均匀,远离型材中心的散热片齿部流速过慢。通过对导流模结构的调节,使得型材出口流速基本均匀,模具应力降低,提高了模具的使用寿命。模拟结果为导流模优化设计提供了依据。
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| 关 键 词： | 导流模挤压 数值模拟 模具优化 |
Numerical simulation of CPU heat sink extrusion process and die optimum design |
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| HE You-feng,XIE Shui-sheng,CHENG Lei,HUANG Guo-jie,FU Yao. Numerical simulation of CPU heat sink extrusion process and die optimum design[J]. Forging & Stamping Technology, 2009, 34(4). DOI: 10.3969/j.issn.1000-3940.2009.04.032 |
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| Authors: | HE You-feng XIE Shui-sheng CHENG Lei HUANG Guo-jie FU Yao |
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| Affiliation: | State Key Laboratory for Fabrication and Process of Nonferrous Metals;Beijing General Research Institute of Nonferrous metals;Beijing 100088;China |
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| Abstract: | Based on the rigid-viscoplasticity finite element method,the pocket die extrusion process of CPU heat sinks was successfully simulated using Deform-3D software.The distribution of extrusion load,stress field and the velocity in the die exit and metal flow in the extrusion process were obtained.The simulation results show that the metal flow velocity in the bearing exit of the original die is non-uniform;especially the heat sink fins velocities of the outer profile are more slowly.Aiming at solving this prob... |
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| Keywords: | pocket die extrusion numerical simulation die optimum design |
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