| 片式元件与基板间隙对SnAgCu系无铅焊点的应力分析 |
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| 引用本文： | 杨洁. 片式元件与基板间隙对SnAgCu系无铅焊点的应力分析[J]. 电子与封装, 2010, 10(3): 1-4 |
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| 作者姓名： | 杨洁 |
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| 作者单位： | 南京信息职业技术学院机电学院,南京,210046 |
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| 摘 要： | 文章采用非线性有限元方法,重点讨论了片式元件与基板的间隙对Sn-2.5Ag-0.7Cu无铅钎料焊点的应力应变分析。研究表明,在实际中适当增大间隙高度有利于改善焊点的应力分布情况。当间隙高度为0.1mm~0.2mm时,元件底部拐角处、焊根的顶部和底部以及焊趾顶部的应力值普遍较低,应力分布得到了较好的改善,这一结果对于焊点的优化及设计具有指导意义。
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| 关 键 词： | SnAgCu系无铅钎料 间隙 应力应变 焊点可靠性 |
The Stress Distribution Analysis of Stand-off between Chip Component and Substrate on SnAgCu Solder Joint |
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| YANG Jie. The Stress Distribution Analysis of Stand-off between Chip Component and Substrate on SnAgCu Solder Joint[J]. Electronics & Packaging, 2010, 10(3): 1-4 |
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| Authors: | YANG Jie |
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| Affiliation: | Electrical and Mechanical Engineering;Nanjing College of Information Technology;Nanjing 210046;China |
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| Abstract: | The analysis of stand-off height between chip component and substrate on the stress-strain distribution situation of Sn-2.SAg-0.TCu lead-free solder joint are investigated with nonlinear finite element method. The results show that properly increased the stand-offheight can be propitious to the stress distribution situation of the solder joint The equivalent stress is lower at the bottom corner of the component, the top and bottom of solder joint when stand-off height between 0. 1mm-0.2mm. The results are of importance to design and optimize of solder joint. |
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| Keywords: | SnAgCu lead-free solder stand-off height stress-strain distribution solder joint reliability |
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