| 厚膜混合集成电路可靠性技术 |
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| 引用本文： | 罗俊,秦国林,李晓红,邓永芳,邢宗锋. 厚膜混合集成电路可靠性技术[J]. 微电子学, 2011, 41(1) |
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| 作者姓名： | 罗俊 秦国林 李晓红 邓永芳 邢宗锋 |
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| 作者单位： | 中国电子科技集团公司,第二十四研究所,重庆,400060 |
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| 摘 要： | 总结了混合集成电路的主要失效模式,在此基础上,主要从混合集成电路的设计和工艺两方面分析了其产生的原因,通过设计、工艺、原材料和元器件等方面采取对策和措施,达到提高混合集成电路可靠性的目的.
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| 关 键 词： | 混合集成电路 可靠性 失效模式 失效机理 |
Reliability Techniques for Hybrid Integrated Circuits |
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| LUO Jun,QIN Guolin,LI Xiaohong,DENG Yongfang,XING Zongfeng. Reliability Techniques for Hybrid Integrated Circuits[J]. Microelectronics, 2011, 41(1) |
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| Authors: | LUO Jun QIN Guolin LI Xiaohong DENG Yongfang XING Zongfeng |
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| Affiliation: | LUO Jun,QIN Guolin,LI Xiaohong,DENG Yongfang,XING Zongfeng(Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corporation,Chongqing 400060,P.R.China) |
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| Abstract: | Major failure modes of hybrid IC products were summarized.Based on the summary,causes for failures of hybrid IC's were analyzed from the point of view of circuit design and fabrication process.By taking proper measures in design and manufacturing,and choosing right materials and components/devices,the reliability of hybrid IC's can be improved. |
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| Keywords: | Hybrid integrated circuit Reliability Failure mode Failure mechanism |
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