基于轮廓法的金刚石线锯整周三维表面形貌测量和评价

针对毫米级尺度线径和微米级尺度磨粒的金刚石线锯整周三维表面形貌测量难以实现与定量评价问题，提出一种基于轮廓法的圆周扫描表面磨粒形貌测量与分析方法。通过显微测量系统沿周向扫描采集金刚石线锯对应的边缘轮廓图像序列，经图像处理后获得金刚石线锯整个圆周表面形貌的坐标点云，采用三次样条插值法对数据进行平滑处理，经圆柱坐标变换处理，可重构金刚石线锯三维表面形貌。在金刚石线锯常用评价参数基础上，提出基于扫描过程二维投影轮廓和三维重构形貌的综合评价参数。采用自行研制的测量系统，对两个规格的线锯（线径外径分别为0.250 mm、0.320 mm；磨粒粒径范围30~40 μm）进行测量和评价。试验结果表明：该方法无需多次拼接，就可完成金刚石线锯整周三维微观形貌测量，并能实现对线锯特征参数的全面评价，可为线锯本身制造及使用过程中的工艺优化提供更加客观的基础数据。

Measurement and Evaluation of Full Circumferential Three-dimensional Surface Topography of Diamond Wire Saw Based on Contour Method

Aiming at measuring and quantitatively evaluating the full circumferential three-dimensional surface topography of millimetric scale diamond wire saw and micro scale abrasive, a surface circumferential scanning method based on microscopic images contours is proposed. First, Point cloud data is obtained by processing sequential scanning microscopic contour images of diamond wire saw. Then the spatial coordinates of point cloud data are obtained, and three-dimensional surface topography are reconstructed by using cubic spline interpolation and coordinate transformation. Besides the common evaluation parameters of diamond wire saw, more evaluation parameters are defined on the basis of the 2D projection contours and 3Dreconstructed surface topography. Based on the self-developed measurement system, two wire saws (diameters 0.250 mm and 0.320 mm; grains diameter in the range of 30-40 μm) are measured and evaluated. Experimental results indicate that the proposed method can be used to measure the full circumferential three-dimensional surface topography of diamond wire saw without multiple stitching, and comprehensively evaluate wire saws using the characteristic parameters, which provide useful objective basic data for the manufacturing and the process optimization of wire saws.