钛上电镀铜工艺对镀层性能的影响

钛材表面采草酸刻蚀、预镀等工艺处理后，表面积和粗糙度都增大，从而可获得结合力良好的铜镀层。研究了在钛基上镀铜时，电流密度在1－3A/dm^2间变化时对镀层性能以及微观结构的影响。结果显示，随着电流密度的增加，沉积物晶料尺寸增大，镀层粗糙度增加。认为控制电镀晶粒尺寸的主要因素是Cu^2 在阴极与电解质界面的含量及阴极表面吸附的杂质量；另外，晶粒尺寸越大，镀层越厚，室温电阻率越低。

Copper Electroplating of Titanium

The effects of cathodic current density (1 ～ 3 A/dm2)and surface state of substrate on thickness, structure and adhesion of the copper deposited titanium were investigated. It was shown that the roughness and the total surface area of titnium could increase after oxalic acid etching and copper preplating, thus improving the adhesion of the copper deposit with the substrate. The experimental results also showed that the grain size and surface roughness increased with current density increasing. The phenomena were discussed in the paper.