辅助交变低气压-温度梯度微细电铸技术

具有超深或高深宽（径）比( HAR)微结构特征的高质量电铸，是制造金属微机械器件和半导体通孔金属化的技术关键之一。开发了一种新的电铸技术：辅助交变低气压一温度梯度微细电铸技术，并介绍了该技术的基础理论，分析了其作用机理，研制了实施该技术的专用装置，进行了微细电铸试验。分析了微细电铸镍元部件的形貌特征及其影响因素。研究结果表明，与常规电铸工艺相比，采用辅助交变低气压微细电铸工艺，能显著减少电铸件的气孔缺陷，增强电充填深铸能力，改善形貌质量。

Novel Microelectroforming Technique with Assisting Low Air-pressure Alternately and Temperature-gradient

Microelectroforming for ultra-deep or high-aspect-ratio (HAR) features is one of the most important technical keys to fabricate metallic devices of microsystem as well as semiconductor vias. A new microelectroforming technique using assisting low air-pressure alternately and temperature-gradi- ent surroundings in the bath was introduced. The related theories and mechanism were reported, and further experiments were carried out using special equipment newly developed by oneself to demon?strate the feasibility of the exploited technique. The morphology and the effective factor of the micro- electroforming coil were analyzed. Research results show that comparing with conventional electro?forming process, the proposed process can reduce gas void, enhance electro-filling deep-electroforming ability, and improve morphology guality greatly.